Huawei
BBU5900
What it does: Baseband processing. Technologies: GSM eGBTS; UMTS; LTE FDD/TDD; NB-IoT; NR; multi-mode board configurations.
2 part numbers: 02311VFF / 02312RTQ
Viewing: model overview
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Main specifications
TechnologiesGSM eGBTS; UMTS; LTE FDD/TDD; NB-IoT; NR; multi-mode board configurations
CapacityLTE FDD, limitation MPT: UMPTb1/b2 — 36 × 20 MHz 4T4R/8T8R, UL+DL 1.5 Gbit/s, 10800 RRC UE; UMPTb3/b9 — 36 × 20 MHz 4T4R/8T8R, 2 Gbit/s, 10800 UE; UMPTe — 72 × 20 MHz 4T4R / 36 × 20 MHz 8T8R / 18 × 20 MHz 32T32R, 10 Gbit/s, 14400 UE; UMPTga — 72 × 20 MHz 4T4R / 36 × 20 MHz 8T8R/32T32R, 10 Gbit/s, 14400 UE; UMPTg — 144 × 20 MHz 4T4R / 72 × 20 MHz 8T8R / 54 × 20 MHz 32T32R, 20 Gbit/s, 28800 UE; actual capacity is also limited by installed BBP
SynchronizationSubsystem MPT + SCU; external reference synchronization input; GNSS and TOD based on installed UMPT/USCU
ChassisBTS5900: BTS3900 (Ver.E_A–D/C/D), BTS5900; BTS5900L: BTS3900L (Ver.E_B–D/C/D), BTS5900L; BTS5900A: APM30H/TMC11H (Ver.F_B–D/E/D); DBS5900: APM5930, APM30H/TMC11H (Ver.E/D), IMB05, INS12, ILC29 (Ver.E), IBC10 (Ver.B), INS05
ModulesUMPTb1/b2/b3/b9, UMPTe1/e2, UMPTg1/g2/g3, UMPTga1/ga2/ga3; UBBPd1–d6/d9, UBBPe1–e6/e18, UBBPg1/g2/g2a/g3b/g3/g4, UBBPei/em/ex2/f1/f3/fw1; USCUb11/b14/b16/b18; UPEUe; UEIUb; FANf
Functional roleProcessing baseband UL/DL and signaling, base station resource and operations management
Interfaces and data ratesTransport UMPTb: FE/GE; UMPTe/UMPTga: FE/GE/10GE; UMPTg: FE/GE/25GE; fronthaul CPRI/eCPRI via UBBP; CI inter-BBU; USB; RS485 and discrete alarms
Interfaces / connectorsOn UMPT: RJ45, SFP, SMA, USB; per UBBP: SFP/QSFP by board type; power supply UPEUe: HDEPC; monitoring: RJ45
Power supply−48 V DC; operating range −38.4…−57 V DC
Additional technical information
- Installation environment
- −20…+55 °C (continuous operation); 5–95% RH; height ≤4000 m; ETSI EN 300 019-1-3 Class 3.1
- Weight
- 18 kg (full configuration)
- IP rating
- IP20
- Dimensions
- 86 × 442 × 310 mm (H × W × D)
- Bandwidth
- Processed bandwidth per cell, based on configuration BBP: LTE FDD 1.4/3/5/10/15/20 MHz; typical NR FDD 20 MHz, NR TDD Sub-6 up to 100 MHz, NR mmWave up to 200 MHz with UBBPg3
- Architecture
- Modular: BBP, MPT, backplane, FAN, PEU, EIU, SCU; separate subsystems baseband, transport, management, monitoring and synchronization
- Slots
- 11 slots with half-width boards; 8 slots with full-width boards; power supply UPEUe: 19 > 18; FANf: 16; UEIUb: 18
- Subtype
- Modular baseband processing unit
- Details
- Heat sink up to 2100 W at FANf; sound power ≤7.2 bels
- Installation conditions
- Cabinets BTS5900/BTS3900; APM30H/TMC11H; IMB05/INS12